Discount Nanoscale Fab Equipment Solutions Supplier, Product

Enabling Next-Gen Silicon Processing with Sub-Micron Precision At XXY, we operate at the threshold of physics. We specialize in the high-precision components required for semiconductor capital equipment, where vacuum integrity and particle-free surfaces are paramount. From lithography frames to wafer-handling end-effectors, we provide the stability needed for reliable nanoscale manufacturing.

Product Description

We're an ISO 9001:2015 certified CNC machining manufacturer. With years of experience, we deliver quality parts on time and within budget. Our advanced facilities handle small-batch to large-scale projects. We keep investing in tech to meet customer needs.
Chamber Tech

UHV Chamber Interior Components

Process-critical liners, gas distribution plates (showerheads), and cathode housings. Machined from high-purity materials with verified micro-grain structures for consistent plasma behavior.

Lithography

Precision Lithography Frames

Massive, high-stability structural supports for optical stages. We focus on thermal stability and vibration isolation, machining large-scale blocks with sub-micron repeatable datums.

Precision Machined Component 1
Precision Machined Component 2
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Core Engineering Capabilities

Vacuum Integrity Mastery

Specialized in machining components for Ultra-High Vacuum (UHV) environments. We ensure zero virtual leaks through optimized pocket design and achieve Ra 0.2 surface finishes to minimize outgassing in fab chambers.

Sub-Micron Flatness

For wafer-stage and lithography components, we maintain flatness and parallelism within 0.002mm across large surface areas, essential for maintaining focus-depth accuracy in nanometer nodes.

Ultra-Pure Material Control

Expert handling of high-purity aluminum, quartz, and engineering ceramics. Our processes eliminate cross-contamination, ensuring that every part meets the stringent cleanliness required for front-end fab operations.

UHV Component Processing 1
UHV Component Processing 2
UHV Component Processing 3

Wafer Handling End-Effectors

High-stiffness arms for high-speed wafer transport robots. Machining light-weight, ceramic-coated or ESD-safe components designed for minimal particle generation and maximum positional speed.

Sub-Micron Coordinate Metrology

Utilizing air-bearing CMMs and laser interferometers to verify geometric tolerances that are invisible to the naked eye but critical for silicon wafer alignment.

Semiconductor Fab Hardware & Manufacturing Process
01

Precision Design Review

Our engineers analyze CAD files for thermal drift potential and vacuum seal integrity, optimizing layouts for sub-micron stability.

02

High-Purity Sourcing

Procuring source-verified materials with full outgassing profiles. We ensure that raw stock is free from chemical inclusions that could contaminate the fab.

03

Ultra-Stable Pathing

CAM pathing designed for minimum thermal input, preventing material expansion and ensuring the highest level of surface flatness on critical stages.

04

Non-Marring Workholding

Using polymer-tipped fixtures and non-contaminating vacuum chucks to secure delicate fab parts without introducing trace-metal transfer.

05

High-RPM Precision Cutting

Executing sub-micron features using high-frequency spindles and oil-free MQL lubrication systems to maintain purity during the cut.

06

Coordinate Metrology Audit

100% inspection of critical datums. We utilize automated CMM sequences to verify parallelism and flatness across the entire batch.

07

Cleanroom de-Contamination

Multi-stage ultrasonic cleaning in deionized water, followed by vacuum baking to ensure components arrive with zero manufacturing residual.

08

Vacuum-Sealed Delivery

Parts are double-bagged in cleanroom environments with full documentation: Vacuum leak test certificates, purity logs, and CMM reports included.

Semiconductor Cleanroom Tech

Cleanroom Surface Preparation

Integrated ultrasonic cleaning and chemical passivation protocols specifically designed to meet the particle-count standards of ISO Class 5 fab environments.

Exotic Fab Material Mastery

Years of experience machining brittle or reactive materials like Quartz, Silicon Carbide, and Engineering Ceramics using specialized diamond tooling and ultra-stable spindles.

Production Inspection Group 1
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Production Inspection Group 3
Nanoscale Excellence: From Silicon Blueprint to Particle-Free Delivery
Al-Si-SiC Composite Mastery
Integrated Vacuum Suction Paths
Vibration-Damped Architectures
Invar & Low-Expansion Alloys
Master-Datum Alignment ±5μm
Stress-Relieved Large Machining
High-Purity 6061/7075 Aluminum
Complex Micro-Hole Drilling
Electro-Polished Internal Radii

Frequently Asked Questions (FAQ)

What certifications cover your CNC manufacturing processes?

We are a fully certified ISO 9001:2015 CNC machining manufacturer, ensuring that quality management systems govern all of our semiconductor-grade processes.

How do you achieve the flatness requirements for wafer-stage components?

For wafer-stage and lithography components, we maintain flatness and parallelism within 0.002mm across large surface areas through advanced stress-relief techniques, ultra-stable spindles, and air-bearing CMM metrology verification.

What materials do you specialize in for semiconductor fab hardware?

We specialize in high-purity aluminum (6061/7075), quartz, engineering ceramics, Al-Si-SiC composites, Invar, and low-expansion alloys to meet the high thermal and mechanical stability demands of frontend fab operations.

How do you prevent outgassing in ultra-high vacuum (UHV) environments?

We utilize optimized pocket design to prevent virtual leaks, execute Ra 0.2 surface finishes, perform multi-stage ultrasonic cleaning in deionized water, and follow up with vacuum baking to completely eliminate manufacturing residuals.

What cleaning and packaging protocols do you apply to finished parts?

Our parts undergo Cleanroom Surface Preparation, including chemical passivation and ultrasonic cleaning matching ISO Class 5 standards. The components are then double-bagged inside cleanrooms and delivered with vacuum leak test and CMM reports.

Can you handle custom small-batch prototyping as well as high-volume runs?

Yes. Our advanced manufacturing facility and CAD engineering review teams are equipped to handle everything from small-batch prototypes requiring custom design optimizations to large-scale mass production runs.

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