Process-critical liners, gas distribution plates (showerheads), and cathode housings. Machined from high-purity materials with verified micro-grain structures for consistent plasma behavior.
Massive, high-stability structural supports for optical stages. We focus on thermal stability and vibration isolation, machining large-scale blocks with sub-micron repeatable datums.
Specialized in machining components for Ultra-High Vacuum (UHV) environments. We ensure zero virtual leaks through optimized pocket design and achieve Ra 0.2 surface finishes to minimize outgassing in fab chambers.
For wafer-stage and lithography components, we maintain flatness and parallelism within 0.002mm across large surface areas, essential for maintaining focus-depth accuracy in nanometer nodes.
Expert handling of high-purity aluminum, quartz, and engineering ceramics. Our processes eliminate cross-contamination, ensuring that every part meets the stringent cleanliness required for front-end fab operations.
High-stiffness arms for high-speed wafer transport robots. Machining light-weight, ceramic-coated or ESD-safe components designed for minimal particle generation and maximum positional speed.
Utilizing air-bearing CMMs and laser interferometers to verify geometric tolerances that are invisible to the naked eye but critical for silicon wafer alignment.
Our engineers analyze CAD files for thermal drift potential and vacuum seal integrity, optimizing layouts for sub-micron stability.
Procuring source-verified materials with full outgassing profiles. We ensure that raw stock is free from chemical inclusions that could contaminate the fab.
CAM pathing designed for minimum thermal input, preventing material expansion and ensuring the highest level of surface flatness on critical stages.
Using polymer-tipped fixtures and non-contaminating vacuum chucks to secure delicate fab parts without introducing trace-metal transfer.
Executing sub-micron features using high-frequency spindles and oil-free MQL lubrication systems to maintain purity during the cut.
100% inspection of critical datums. We utilize automated CMM sequences to verify parallelism and flatness across the entire batch.
Multi-stage ultrasonic cleaning in deionized water, followed by vacuum baking to ensure components arrive with zero manufacturing residual.
Parts are double-bagged in cleanroom environments with full documentation: Vacuum leak test certificates, purity logs, and CMM reports included.
Integrated ultrasonic cleaning and chemical passivation protocols specifically designed to meet the particle-count standards of ISO Class 5 fab environments.
Years of experience machining brittle or reactive materials like Quartz, Silicon Carbide, and Engineering Ceramics using specialized diamond tooling and ultra-stable spindles.
We are a fully certified ISO 9001:2015 CNC machining manufacturer, ensuring that quality management systems govern all of our semiconductor-grade processes.
For wafer-stage and lithography components, we maintain flatness and parallelism within 0.002mm across large surface areas through advanced stress-relief techniques, ultra-stable spindles, and air-bearing CMM metrology verification.
We specialize in high-purity aluminum (6061/7075), quartz, engineering ceramics, Al-Si-SiC composites, Invar, and low-expansion alloys to meet the high thermal and mechanical stability demands of frontend fab operations.
We utilize optimized pocket design to prevent virtual leaks, execute Ra 0.2 surface finishes, perform multi-stage ultrasonic cleaning in deionized water, and follow up with vacuum baking to completely eliminate manufacturing residuals.
Our parts undergo Cleanroom Surface Preparation, including chemical passivation and ultrasonic cleaning matching ISO Class 5 standards. The components are then double-bagged inside cleanrooms and delivered with vacuum leak test and CMM reports.
Yes. Our advanced manufacturing facility and CAD engineering review teams are equipped to handle everything from small-batch prototypes requiring custom design optimizations to large-scale mass production runs.